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IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 2009o
IBL – Stato del Progetto,Attività e Richieste
IBL – Stato del Progetto,Attività e Richieste
Roma, July 23rd, 2009G. Darbo - INFN / Genova
Agenda Page:
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20092
PROJECT STATUSPROJECT STATUS
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20093
IBL StatusIBL StatusProject formally started:
• Project Leader endorsed by CB (Feb 2009)• IBL Management Board – Endorsed by ATLAS Executive Board (April 2009)• IBL (Institute Board) Kick-off meeting – July 8th
• To converge towards a MoU for the IBL project
TDR• Editor (K. Einsweiller) and Chapter Editors selected – Final version April
2009.
Guide line for project schedule (ATLAS UPO – 21/7/2009)• target the installation for the second half of 2014. (shutdown 2014/15) • assume an 8 months shutdown time for the IBL installation• decouple the IBL installation from the LHC phase 1 upgrade (!)
Last IBL General Meeting June 25th & 26th • 42 talks – 2 full day technical discussion• Whole project covered including software• http://indico.cern.ch/conferenceDisplay.py?confId=54685
Institutes Present at the IBL kick-off
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20094
IBL Project & OrganizationIBL Project & OrganizationThe IBL (Insertable B-Layer) is an ATLAS Upgrade project:
• It will deliver a fourth pixel layer, including a new beam-pipe, to the Inner Detector
• When delivered, it will become a part of the Pixel Detector and of the Inner Detector and the organization will be “absorbed” into the Pixel & ID
The organization structure has:• IBL MB: Management Board to execute the project
• IBL IB: Institute Board, is an extension of the existing Pixel IB
Module WG
Module WG
IBL MB(Management
Board)
IBL MB(Management
Board)
StaveWG
StaveWG
I&IWGI&IWG
Off-detWG
Off-detWG
IBL IB(Institute Board)
IBL IB(Institute Board)
Pixel Institutes
in IBL
Pixel Institutes
in IBL
New Institutes
in IBL
New Institutes
in IBL
ATLASUPO
ATLASUPO
ATLAS UPGRADE
IBL
IBL PLIBL TC
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20095
Management Board (MB)Management Board (MB)
Module WG(2 coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation
Module WG(2 coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation
Stave WG(1 Phys + 1
Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC
Stave WG(1 Phys + 1
Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC
IBL Integr.-Install.(2 Eng.)
•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC
IBL Integr.-Install.(2 Eng.)
•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC
Off-detector(1 Phys + 1 E.Eng.)•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test
Off-detector(1 Phys + 1 E.Eng.)•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test
IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members
IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members
Ad-interim membershipIBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG (2 Physicists): F. Hügging & M. Garcia-Sciveres“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni“IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux“Extra” members:Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling)Offline “liaison” Pixel Off-line coordinator: A. AndreazzaTDR editor (temporary): K. Einsweiler
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20096
TECHNICAL OVERVIEWTECHNICAL OVERVIEWFor more information – CSN1 November ’08 & March ’09
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20097
Requirements for Sensors/ElectronicsRequirements for
Sensors/ElectronicsRequirements for IBL
• IBL design Peak Luminosity = 3x1034 cm-2s-1 New FE-I4, higher hit rate• Integrated Luminosity seen by IBL = 550 fb-1
• Total NIEL dose = 2.4 x 1015 ± 30% (σpp) ± 50% (damage factor) = 4.7 x 1015 neq/cm2
more rad-hard sensors• Total radiation dose > 200 Mrad
€
Φ(r) =493
r2+
25
r
⎛
⎝ ⎜
⎞
⎠ ⎟×1014
• Fit made for 2 < r < 20 cm for L=1000fb-1
• Gives for IBL @ 3.7 cm (550 fb-1):
Φ1MeV=2.4x1015 (1.2 MGy)
• Safety factors not included in the computation (pp event generator: 30%, damage factor for 1 MeV fluences: 50%)Ref. Ian Dawson - AUW
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20098
Ref: N. Hartman:•http://indico.cern.ch/conferenceDisplay.py?confId=43496
Predominant Stave LayoutsPredominant Stave LayoutsSeveral layouts under study: 14 staves at Rmin=~3.2 cm• Single and double staves – One or two (redundant) cooling channels
Inverted
Sensor Sensor
Biturbine
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20099
• The beam pipe flange on A-side is to close to the B-layer envelope . Need to be cut on the aluminum section
• A structural pipe is inserted inside the Beam Pipe and supported at both sides.
• The support collar at PP0 A-side is disassembled and extracted with wires at PP1.• Beam pipe is extracted from the C-side and it pulls the wire at PP1
• New cable supports are inserted inside PST at PP0.
• A support carbon tube is pushed inside the PST along the structural pipe.
Started to setup a 1:1 mock-up of Pixel/beampipe/PP1 in Bat 180
A-side C-side
IBL Installation: Beam Pipe Extraction
IBL Installation: Beam Pipe Extraction
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200910
IBL Installation Scenario IIBL Installation Scenario I
• The support carbon tube is fixed in 2 point of PP0 and on PP1 walls on side C and A.
• The structural pipe with a support system is moved out from the support carbon tube.
• The new beam pipe (in any configuration with OD up to 82,5 mm) is inserted from C-side. It has 2 supports at PP0 area and 2 floating wall at PP1 on side A and C.
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200911
Module Layout - ConvergenceModule Layout - ConvergenceDecision between Planar and 3D sensors will be done after TDR• Need module prototypes with FE-I4 (second half 2010)
Common sensor baseline for engineering and system purposes• 3D sensors – single chip modules / Planar sensors – 2 chip modules
Sensor/module prototypes for ~10% of the detector in 2010• Stave prototype tested with modules and cooling
Credits: M.Garcia-Sciveres – F. Hügging
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200912
FE-I4 StatusFE-I4 Status
FE-I4 Status• Prototype blocks in MPW (MOSIS) submitted 3/2008,
measurements, irradiation
• Design review (3/2009): “system & design issue” on full scale design
• FE-I4 Design Collaboration Meeting - July 1st & 2nd ‘09
• Pre-submission design review – end of Sept./Oct.
• Submission ~ 1month later
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200913
Test Beam (June ‘09) – FBK 3D Sensors
Test Beam (June ‘09) – FBK 3D Sensors
Comparison of 3D and Planar• Test beam with magnetic field
• Planar sensors are sensitive to Lorentz angle: maximize charge at incidence angle = Lorentz angle
• 3D (electric field parallel to sensor surface) are not.
• Active edge: ~5 to ~10 µm from edge (see picture at the right)
3D FBK ToT at 15o 3200e-
planar
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200914
INFN ACTIVITY 2009/10INFN ACTIVITY 2009/10
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200915
BO (GE) : Attività 2010 (ROD)BO (GE) : Attività 2010 (ROD)
BO new entry in “Pixel World”• Expertise in complex digital architecture • Design and production of new ROD – in
collaboration with GE (P. Morettini)
Pix ROD
Pix RODUpdate
FPGA/DSP e-BOC BOC
Test SystemModule/Stave/
Test Beam
IBL RODNew Board
Port FPGA/DSP code
IBL ROD DevDevelopment
System for IBL ROD
Upgraded Test System
Proto System Test(Use for Stave Test?)
System Test
IBL R/O
2009
2010
2011
2012
2013
Bologna
Genova
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200916
Sensori 3D• Sono una dei tipi si sensori che
potrebbero essere gia’ usati per l’IBL e, in futuro, per il tracciatore di ATLAS per sLHC.
• Sensori prodotti all’IRST Trento, bump-bondati all’AMS con FEI3, assemblaggio e test in Genova.
• Risultati incoraggianti sia dai test di laboratorio che al test beam.
Progettazioni servizi interni• Disegno dei servizi a PP0
(dall’elettronica di Front end alla fine dello stave)
• Forti constraint imposti dalla minimizzazione del X0, dall’elettronica (caduta di potenziale), procedure di assemblaggio. TOT
Misura dellacarica rilasciataal test beam
Noise
GE : Attività 2009GE : Attività 2009
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200917
Sensori 3D• Sono una dei tipi si sensori che
potrebbero essere gia’ usati per l’IBL e, in futuro, per il tracciatore di ATLAS per sLHC.
• Sensori prodotti all’IRST Trento, bump-bondati all’AMS con FEI3, assemblaggio e test in Genova.
• Risultati incoraggianti sia dai test di laboratorio che al test beam.
Progettazioni servizi interni• Disegno dei servizi a PP0
(dall’elettronica di Front end alla fine dello stave)
• Forti constraint imposti dalla minimizzazione del X0, dall’elettronica (caduta di potenziale), procedure di assemblaggio.
Bus
FE/module Pigtail
JunctionBus-Pigtail
Wire-BondingsFE- Pigtail
1.11
LV1 LV2 LV3 LV4GND1 GND2 GND3 GND4
Signals for mod1
Signals for mod2
Signals for mod3
Signals for mod4
GE : Attività 2009GE : Attività 2009
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200918
Sensori 3D• Continua la stretta collaborazione con l’IRST testando i sensori
da loro prodotti e dando feedback. • Bump Bonding all’AMS, Assemblaggi e test in laboratorio• Test beam al Cern• irraggiamento
Produzione prototipi flex bus e pigtail• Prima prototipaggio al CERN• Test elettrici, in particolare propagazione dei segnali – 160
Mbits per 7m)• Studio e test:
• Incollaggio sul supporto meccanico del bus (critico per il CTE)• Incollaggio dei pigtail sui moduli (critico per il wire bonding)• Giunzione dei pigtail al flex
FEI4• Sviluppo del chip• Test setup per test delle nuove device• Integrazione con la DAQ (ROD/BOC, software)
Supporto in lavorazione stave (in collaborazione con Mi)
GE : Attività 2010GE : Attività 2010
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200919
MI : Attività 2009MI : Attività 2009
Design e produzione prototipi carbon pipes per stave “omogeneo”.• Gestione della produzione prototipi CF pipe (Stoccarda)
[produzione in Sezione tooling, facilities, dwgs] • Qualifica a pressione e leak-rate
Simulazione per il calcolo:• della figura di merito dello stave• del thermal run-away.• Del CTE della pipe e della resistenza strutturale
Misura della conduttivita trasversa del laminato della pipe.
Sviluppo connessione CF/Ti per cooling Pipe.
19
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200920
MI : Attività 2010MI : Attività 2010PP2 boxes con relativo re-design delle regulator-boards.• Il progetto IBL prevede l’utilizzo di un nuovo chip in tecnologia
0.13mm (FEI4) e quindi con diversi valori di tensione e corrente• Studio delle modifiche da apportare alle LV regulation station, in
particolare con re-design delle boards di connessione per minimizzare Vdrop lungo le linee di alimentazione
Verifica resistenza alla crescita di micro-cricche nella matrice del laminato della pipe sotto tensione e dopo irraggiamento [reattore PV].
Cooling [supporto di personale e setups di test]• Qualifica della CF pipe e stave su sistema evaporativo a C3F8 (o
blends) o CO2• Verifica transitori termici e max T build-up su sensori durante il
bake-out della beam pipe
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200921
Full 3D detectors (passing through columns) with slim edge are proposed
Double-side technology approach, already proved on test structures of 250 mm thickness.
One batch with FE-I3 ATLAS single chips is currently being fabricated
250 m
TN/UD/FBK (GE) : Attività 2009TN/UD/FBK (GE) : Attività 2009
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200922
From TCAD simulations, a 170 m distance between active area and saw cut is feasible.
With this structure, a steep increase in the current due to edge contribution takes place at Vrev ~ 200V (well beyond operation voltage)
Post irradiation, edge current is not an issue
Saw cut
FBK : Slim EdgeFBK : Slim Edge
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200923
UD : Simulazioni TCADUD : Simulazioni TCAD
Numerosi processi (anche su farmts)
Simulazioni 2D su sezioni orizzontali e verticali• incluse impiantazioni superficiali e p-spray• idonee per valutare l’insorgere del breakdown
• distanza critica fra colonne e impiantazioni superficiali
• carica deposta nell’ossido dalla radiazione incidente (QOX)
Simulazioni tridimensionali• utilizzate per stime di capacità
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200924
UD (TN) : Attività 2010UD (TN) : Attività 2010
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200925
FINANCIALFINANCIAL
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200926
CostCost
What in prototype costs:• Sensors: Planar, 3D, Diamond (1)
• Electronics: FE-I4
• Hybridisation: bump-bonding
• Local supports: stave
• Beam-pipe: mock-up
• External cooling: Thermal management
What not:• All other electronics / mechanical prototypes
• Irradiation and test beam
(1) Diamond prototype added to cost - if diamond are the IBL sensors, the IBL cost will increase by > 1MCH.
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200927
WBS - INFNWBS - INFN
INFN deliverables: 932kCH 17 %Not covered: 143 kCH
Total : 1075 kCH 19 %
INFN deliverables: 932kCH 17 %Not covered: 143 kCH
Total : 1075 kCH 19 %
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200928
Some “Envelopes” to Shape Participation
Some “Envelopes” to Shape Participation
IBL Total Cost: 9.6 MCH• M&O-A: 4.0 MCH• M&O-B (for Countries with “pixel M&O-B” budget line – listed in the
table): 4.4 MCH• CZ, F, D-BMBF, D-DESY, I, RZ, US, CERN
• New project contributions: 1.2 MCH• CH, E, N, UK
IBL M&O-B:• There are not a-priory boundaries
amongst Countries, but some reference can be considered fromthe old Pixel CORE to evaluate howcountries are consolidated in the“pixel technology” needed for IBL
MoU• Interim-MoU – i-MoU first version is expected to be available by the
end of the year and should converge to final MoU with the writing of the TDR.
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200929
INFN Contribution to IBLINFN Contribution to IBL
INFN Contribution proposal:• Assigned for deliverables:
932 kCH (16.4%) + “not covered”: 143 kCH = 1075kCH (19 %)
• M&O-A: frazione secondo regole ATLAS
• Cost divided in deliverables + common orders (Sensor, FE-I4, bump-bonding) + cash + M&O-A
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200930
BO : Richieste 2010BO : Richieste 2010
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200931
GE : Richieste 2010GE : Richieste 2010
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200932
MI : Richieste 2010MI : Richieste 2010
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200933
UD (TN) : Richieste 2010UD (TN) : Richieste 2010
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200934
BACKUP SLIDESBACKUP SLIDES
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200935
3D Sensors3D Sensors
Large collaboration• 15 Laboratories and 3 processing facilities
Thickness 230±15 mModule type single FE-I4 assembly#electrode 2 per 250mEdge active 5m Edges guard 200m Signal (5x1015) ~12500 e-
Bias (5x1015) ~150VWcm-2( 5x1015) 33mW at -10oCLorentz angle before irr. freeEfficiency (3200 e-) 96% (0o) 99% (15o)Wafer dim. 4”Expected yield ~50%Bias bump-b and pad
FBK & CNM
SINTEF/Stanford
Credits: C. Da Via on behalh of ATLAS 3D Sensor R&D
IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 200936
Bologna - ActivityBologna - Activity
Schedule and estimation of resources for IBL ROD